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Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA assemblies

By: Lau, John HMaterial type: Text

TextPublication details: New York: McGraw Hill Companies, 2000Description: 585p. 24cmISBN: 0-07-135141-8Subject(s): Lead Free Solders | Wafer Level Packaging | Wire Bonding ChipDDC classification: 621.3815

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books	University Visvesvarayya College of Engineering On Display	621.3815 LAU (Browse shelf (Opens below))	Available		UV216T

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