Low Cost Flip Chip Technologies : (Record no. 273646)

MARC details
000 -LEADER
fixed length control field 00548nam a22001937a 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 220902b |||||||| |||| 00| 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 0-07-135141-8
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.3815
Item number LAU
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Lau, John H.
245 ## - TITLE STATEMENT
Title Low Cost Flip Chip Technologies :
Remainder of title for DCA, WLCSP, and PBGA assemblies
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication, distribution, etc New York:
Name of publisher, distributor, etc McGraw Hill Companies,
Date of publication, distribution, etc 2000
300 ## - PHYSICAL DESCRIPTION
Extent 585p.
Dimensions 24cm.
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc Index
563 ## - BINDING INFORMATION
Binding note Soft Bind
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Lead Free Solders
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Wafer Level Packaging
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Wire Bonding Chip
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Item type Books
Holdings
Withdrawn status Lost status Source of classification or shelving scheme Damaged status Not for loan Home library Current library Shelving location Date acquired Total Checkouts Full call number Barcode Date last seen Koha item type
          University Visvesvarayya College of Engineering University Visvesvarayya College of Engineering On Display 02/09/2022   621.3815 LAU UV216T 02/09/2022 Books

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