Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA assemblies
Material type: TextPublication details: New York: McGraw Hill Companies, 2000Description: 585p. 24cmISBN: 0-07-135141-8Subject(s): Lead Free Solders | Wafer Level Packaging | Wire Bonding ChipDDC classification: 621.3815Item type | Current library | Call number | Status | Date due | Barcode |
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Books | University Visvesvarayya College of Engineering On Display | 621.3815 LAU (Browse shelf (Opens below)) | Available | UV216T |
Index
Soft Bind
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