Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA assemblies
Material type: TextPublication details: New York: McGraw Hill Companies, 2000Description: 585p. 24cmISBN: 0-07-135141-8Subject(s): Lead Free Solders | Wafer Level Packaging | Wire Bonding ChipDDC classification: 621.3815Item type | Current library | Call number | Status | Date due | Barcode |
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Books | University Visvesvarayya College of Engineering On Display | 621.3815 LAU (Browse shelf (Opens below)) | Available | UV216T |
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621.3815 KUM Fundamentals of digital circuits | 621.3815 LAN Power electronics | 621.3815 LAN Power electronics | 621.3815 LAU Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA assemblies | 621.3815 LEA A Digital principles and applications | 621.3815 LOI Computer-aided analysis of active circuits | 621.3815 MAH Analog Electronic Circuits: a simplified approach |
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