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MEMS and MOEMS technology and applications

by Choudhurt, Rai P [editor].

Material type: Text Text; Format: print ; Literary form: Not fiction Publication details: New delhi : PHI learning Pri, Lit, 2009Availability: Items available for loan: Bangalore University Library (1) Call number: CHO.

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Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA assemblies

by Lau, John H.

Material type: Text Text; Format: print ; Literary form: Not fiction Publication details: New York: McGraw Hill Companies, 2000Availability: Items available for loan: University Visvesvarayya College of Engineering (1) Call number: 621.3815 LAU.

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