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Microvias : for low-cost, high-density interconnects

By: Lau, John HContributor(s): Lee, S. W. RickyMaterial type: Text

TextPublication details: New York: McGraw-Hill, 2001Description: xxiii, 565p. 27cmISBN: 0071363270Subject(s): Microvias by mechanical drilling | Microvias by Etching | Microvias by EtchingDDC classification: 621.381046

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books	University Visvesvarayya College of Engineering On Display	621.381046 LAU L (Browse shelf (Opens below))	Available		UV096338
Books	University Visvesvarayya College of Engineering On Display	621.381046 LAU L (Browse shelf (Opens below))	Available		UV100748

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