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		No cover image available Microvias : for low-cost, high-density interconnects by Lau, john H \| Lee, ricky S.W. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New york Mcgraw hill companies 2001Availability: Items available for loan: University Visvesvarayya College of Engineering (1) Call number: 621.381 LAU L. Place hold Log in to add tags Add to cart (remove)
		Low Cost Flip Chip Technologies : for DCA, WLCSP, and PBGA assemblies by Lau, John H. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York: McGraw Hill Companies, 2000Availability: Items available for loan: University Visvesvarayya College of Engineering (1) Call number: 621.3815 LAU. Place hold Log in to add tags Add to cart (remove)
		Microvias : for low-cost, high-density interconnects by Lau, John H \| Lee, S. W. Ricky. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York: McGraw-Hill, 2001Availability: Items available for loan: University Visvesvarayya College of Engineering (2) Call number: 621.381046 LAU L, ... Place hold Log in to add tags Add to cart (remove)

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