TY  - BOOK
AU  -  Lau, John H.
TI  -  Low Cost Flip Chip Technologies:  for DCA, WLCSP, and PBGA assemblies 
SN  - 0-07-135141-8
U1  - 621.3815 
PY  - 2000///
CY  - New York
PB  - McGraw Hill Companies
KW  - Lead Free Solders
KW  - Wafer Level Packaging
KW  - Wire Bonding Chip
N1  - Index
ER  -