Microvias : for low-cost, high-density interconnects

By: Lau, John HContributor(s): Lee, S. W. RickyMaterial type: TextTextPublication details: New York: McGraw-Hill, 2001Description: xxiii, 565p. 27cmISBN: 0071363270Subject(s): Microvias by mechanical drilling | Microvias by Etching | Microvias by EtchingDDC classification: 621.381046
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Item type Current library Call number Status Date due Barcode
Books Books University Visvesvarayya College of Engineering
On Display
621.381046 LAU L (Browse shelf (Opens below)) Available UV096338
Books Books University Visvesvarayya College of Engineering
On Display
621.381046 LAU L (Browse shelf (Opens below)) Available UV100748

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