Microvias : for low-cost, high-density interconnects
Material type:
TextPublication details: New york Mcgraw hill companies 2001Description: 565 p. 26 cmISBN: 9780071363270DDC classification: 621.381
| Item type | Current library | Call number | Status | Date due | Barcode |
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Books
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University Visvesvarayya College of Engineering | 621.381 LAU L (Browse shelf (Opens below)) | Available | UV100598 |
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| 621.381 KUM J Power Electronics | 621.381 KUO Network analysis and synthesis | 621.3810 LAM L Drafting for electronics | 621.381 LAU L Microvias : for low-cost, high-density interconnects | 621.381 LEA Microelectronic Devices | 621.381 LEI Designing SOCs with configured cores : unleashing the Tensilica Xtensa and diamond cores | 621.381 LIA Microwave devices and circuits |
It includes bibliographical references and index.
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